Get Ready for the Chips Venture Forum 2025 – A Gateway to Semiconductor Innovation and Investment
- FiCCC
- Aug 7
- 2 min read
Application deadline: September 19, 2025
The Chips Venture Forum is coming this November 2025 – and early-stage semiconductor startups from across Europe are invited to take part in this one-of-a-kind opportunity to meet leading deep tech investors, corporate partners, and key ecosystem stakeholders.
What is the Chips Venture Forum?
It’s a strategic process designed to connect high-potential startups and scaleups with venture capital, corporate investors, and potential customers, from materials and chip design to packaging, quantum, photonics, and process equipment.
The forum is open to all startups whose activities relate broadly to semiconductors – regardless of maturity stage (pre-seed to Series C).
The event’s finale, an on-site pitching session, is held in connection with SEMICON Europa 2025 in Munich. And even if your company isn’t selected to pitch on stage, you’ll still receive a free invitation to the event and full access to its networking opportunities.
All applicants will benefit from:
Investor and corporate matchmaking via online meetings (September–October)
Pitch training provided to selected companies
Networking and visibility with top-tier VCs and industry leaders
Finale: An on-site pitching session in Munich during SEMICON Europa 2025 (15–20 companies selected, November)
Opportunities for Participants
This is a great and rare chance to:
Meet investors who specialize in semiconductor deep tech
Gain visibility through curated investor engagement
Receive mentoring and pitch training
Join a fast-growing European semiconductor community
Finland is part of this growing European effort to build a strong, competitive semiconductor ecosystem. As part of the Chips Competence Centre network, FiCCC is committed to supporting innovation, facilitating access to key stakeholders, and helping Finnish startups take their next big leap on the international stage.
Apply by September 19!
To join the Chips Venture Forum, fill out the application form (available now) by September 19, 2025.
Startups and scaleups can now apply by filling out the official form here:
The form gathers standard investor questions and will help create a catalog of investment opportunities shared with participants and investors. Your slide deck remains confidential and will only be shown to registered VCs.
FiCCC supports Finnish applicants: contact our expert Sirpa Salmi who can help you to perfect your application and pitch deck!
Chips Venture Forum is supported by DG Connect and EIC Accelerator, and leverages the 16-year expertise of the INPHO investor network, including VCs who have backed quantum, silicon photonics, and analog compute startups across Europe.
