top of page

Deep Tech Boost

Chips & Beyond @ Slush

19 November at 8.00–11.00
Helsinki Expo and Convention Center
Chips & Beyond _ Slush (yksikuvainen linkedIn-mainos) (1200 x 1200 px)(2).png

Welcome to Investor & Startup matchmaking!

Step into the future of deep tech innovation with this kick-off session during Slush, designed to explore the cutting-edge of the semiconductor and advanced materials ecosystem. Are you a deep tech investor, startup, R&D professional, or key ecosystem player? This event is built for you!

​

Featuring engaging keynote talks, investor perspectives, and a panel discussion, you’ll gain first-hand insights into the opportunities driving the next wave of innovation. At the end of the session there will be time for pitches and free networking.

Date and time

Wednesday 19 November, at 8:30–11:00AM (networking until 12:00PM), registration starts at 8:00AM

Location

Business Finland Happiness Lounge, Room 208, Congress Wing, Helsinki Expo and Convention Center

Speakers

More speaker bios will be published soon!

Sven De Cleyn_2025 01_006 (1).jpg

Sven De Cleyn

Co-funder,

Program Director

imec.istart

Heikelä kuva.jpeg

Jussi Heikelä

Moderator

.

Om-Nalamasu-900px.png

Dr. Omkaram (Om) Nalamasu

Senior Vice President,
Chief Technology Officer

Applied Materials

Juha Kokkonen.jpg

Juha Kokkonen

CEO

Canatu

Steven Konsek kuva.png

Steven Konsek

Investment Director

Applied Ventures

Program

8.00

8.30

8.35

8.50

Registration and coffee

Opening remarks

Toni Mattila, Head of the Chips Campaign, Business Finland

Industry Keynote

Dr. Omkaram (Om) Nalamasu, Applied Materials

Deep Tech Growth Story

Juha Kokkonen, Canatu

9.00

Finnish Opportunities for Deep Tech Startups

Pasi Pylväs, FiCCC

9.15

9.30

Investor Talk: What are we looking for in investments?

Steven Konsek, Applied Materials

Panel Discussion, moderated by Jussi Heikelä

Steven Konsek, Applied Ventures
Samppa Sirviö, Tesi
Sven De Cleyn, imec.istart

10.00

Deep Tech Pitching

AGATE Sensors
SisuSemi
Chipmetrics
Sensmet
See Through Solutions
Kovilta
Picophotonics

10.40

11.00

11.00–12.00

Networking

End of official program

Free networking in the matchmaking area

Kvanttinova_white_transparent.png
Photonics Finland
BusinessOulu logo
EN V Co-funded by_WHITE.png
Business Finland logo
ChipsJu logo
Chip Fusion

Funded by the European Union. Views and opinions expressed are however those of the author(s) only and do not necessarily reflect those of the European Union or Chips Joint Undertaking. Neither the European Union nor the granting authority can be held responsible for them.

© 2025 BY FiCCC

bottom of page