Pilot Lines
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The Chips for Europe Initiative will build on existing pilot lines, developing an infrastructure capable of bringing new advanced technologies to a higher level of maturity, facilitating accelerated industrial take up and commercialisation.
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These leading-edge facilities will provide the means for industry to test, experiment and validate novel prototype system designs, integrating new breakthrough technologies such as e.g. quantum, AI or neuromorphic, as well as new functionalities such as security or energy efficiency.
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This will help provide immediate feedback to designers to refine and improve their design models before the transfer to manufacturing, allowing them to significantly shorten the development cycle.
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Pilot lines will be available for access to actors of the supply chain on open and non-discriminatory terms; as unique world-class facilities, they will make Europe a strong partner on the global stage, and provide a strong basis to the strengthening of international cooperation.
WBGPilotLine
NanoIC
The WBGPilotLine in Catania is Italy’s most significant research initiative focused on semiconductors. The line emphasizes the development of new semiconductor materials and technologies, including those with high performance and durability.
In collaboration with Tampere University, the line integrates international expertise and resources, supporting innovations that promote sustainable development and competitiveness within Europe’s semiconductor ecosystem.
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Tampere University’s role in the WBGPilotLine focuses on the development and testing of Wideband-gap (WBG) devices and their integration into hybrid system-in-package (SiP) solutions.
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The pilot line at Tampere will advance new semiconductor materials for use in applications such as electric motor controllers, battery management systems, solar inverters, and 5G network base stations. Additionally, the university is developing techniques for System-in-Package (SiP) fabrication, allowing the integration and packaging of semiconductor chips into complete systems. This work is a critical component of broader European semiconductor development efforts.
FAMES
The FAMES Pilot Line, led by CEA-Leti, is part of the EU Chips Act initiative. This pilot line concentrates on advanced semiconductor technologies, particularly in analog, mixed-signal, and power electronics applications. The Fully Depleted Silicon On Insulator (FDSOI) technology facilitates the development of high-performance and energy-efficient circuits, which are crucial for future electronic applications.
The pilot line supports the transition of innovations from the lab to mass production and contributes to Europe’s technological independence.
The NanoIC Pilot Line focuses on advancing semiconductor innovation in technology beyond the 2 nm node. Led by IMEC, this line provides high-level development and manufacturing of integrated circuits in Europe. It accelerates research and development in nanometer-scale circuits, addressing industry needs and supporting Europe’s competitiveness in the global semiconductor market.
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The NanoIC Pilot Line collaborates with various academic, industrial, and research institutions, offering an open platform for the development and commercialization of new technologies.
APECS
The fourth pilot line, named the Advanced Heterogeneous System Integration (AHSI) Pilot Line, will be led by Fraunhofer in Germany. This pilot line is focused on the development of advanced packaging and integration technologies that combine various semiconductor materials, circuits, or components into a single compact system.
This approach, known as heterogeneous integration, is becoming increasingly important as the traditional monolithic scaling of semiconductors (Moore's Law) faces physical and economic limitations.
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The AHSI pilot line will utilize innovative techniques like System-in-Package (SiP) and 2.5D/3D integration to enhance the performance and functionality of semiconductor devices. The goal is to support the European semiconductor industry by providing a platform that accelerates innovation and helps bridge the gap between research and mass production (Chips Ju) (eeNews Europe).
Press releases
